Do you want to design the smallest possible electronics? Our state-of-the-art technology means that you can safely design with BGA footprint: We assure nearly 100% defect-free BGA component placement with 30μm placement tolerances, 2D solder paste inspection and 3D X-ray inspection.
Are you looking into decreasing the size of the electronics you manufacture, but have not found the appropriate partner for placing BGA package components? Go big by thinking small: With the use of state-of-the-art assembly techniques (30μm placement tolerances, 2D solder paste inspection and 3D x-ray inspection) we can assure you that you get the exact final product you ordered. We check the perfect soldering and positioning of BGA and μBGA components with our x-ray inspection technology. This way we can screen out defects that result from short-circuit between legs and from incorrect soldering and we can immediately intervene in the manufacturing process if necessary.
Leave your smallest components to the most skilled hands: Click here and request our free quote: